发明名称 POSITIVE PHOTORESIST COMPOSITION
摘要 PURPOSE: To provide a positive photoresist composition which does not cause development defects when far UV, particularly KrF excimer laser light is used as a light source for exposure and has superior stability in a semiconductor producing process. CONSTITUTION: The positive photoresist composition contains (A) a compound which generates an acid when irradiated with active light or radiation, (B) an alkali-insoluble or slightly alkali-soluble resin which is made alkali-soluble by the action of the acid, (C) a carboxylic acid anhydride having a molecular weight of > 1,000, (D) a nitrogen-containing basic compound and (E) a fluorine- and/or silicon-containing activator.
申请公布号 KR20010082086(A) 申请公布日期 2001.08.29
申请号 KR20010006338 申请日期 2001.02.09
申请人 FUJI PHOTO FILM CO., LTD. 发明人 KAWABE YASUMASA;YAMANAKA TSUKASA
分类号 H01L21/027;C08L25/18;G03F7/004;G03F7/039 主分类号 H01L21/027
代理机构 代理人
主权项
地址