发明名称 |
POSITIVE PHOTORESIST COMPOSITION |
摘要 |
PURPOSE: To provide a positive photoresist composition which does not cause development defects when far UV, particularly KrF excimer laser light is used as a light source for exposure and has superior stability in a semiconductor producing process. CONSTITUTION: The positive photoresist composition contains (A) a compound which generates an acid when irradiated with active light or radiation, (B) an alkali-insoluble or slightly alkali-soluble resin which is made alkali-soluble by the action of the acid, (C) a carboxylic acid anhydride having a molecular weight of > 1,000, (D) a nitrogen-containing basic compound and (E) a fluorine- and/or silicon-containing activator. |
申请公布号 |
KR20010082086(A) |
申请公布日期 |
2001.08.29 |
申请号 |
KR20010006338 |
申请日期 |
2001.02.09 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
KAWABE YASUMASA;YAMANAKA TSUKASA |
分类号 |
H01L21/027;C08L25/18;G03F7/004;G03F7/039 |
主分类号 |
H01L21/027 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|