| 摘要 |
PURPOSE: A semiconductor package is provided to minimize a thickness and a size of a semiconductor package and simplify a manufacturing process of the semiconductor package. CONSTITUTION: A semiconductor power device(10) is formed on a center portion of a semiconductor package(100). The semiconductor power device(10) is mounted on a pad(20). A multitude of lead frame(40) is formed on the same line as the pad(20). The lead frames(40) is connected electrically with the semiconductor power device(10) through a wiring(30). The semiconductor package(100) has a molding portion(50) to protect the lead frames(40), the wiring(30), and the semiconductor power device(10). Connection portions(21,41) are formed at the lead frame(40) and the pad(20), respectively. |
