| 摘要 |
<p>PURPOSE: To provide a semiconductor device in which excellent continuity characteristic is maintained without generating breakdown on the connecting interface of an anisotropic conductive film and a semiconductor element and/or a circuit board even in the case of positioning under environment having a large temperature change. CONSTITUTION: In the semiconductor device in which a semiconductor element 30 is connected electrically to a circuit board 20 through the anisotropic conductive film 10, a plurality of conductive paths 2 are insulated mutually in a film board 1 composed of an insulating resin and penetrated in the thickness direction of the film board in the anisotropic conductive film, and an opening S is formed between the surface 1a of the film board of the anisotropic conductive film and a board surface 21a of the circuit board.</p> |
