ELASTICITY DESIGN OF ELASTIC ADHESIVE FOR SEMICONDUCTOR PACKAGE DRY PAD BY ADJUSTING GLASS TRANSITION TEMPERATURE

摘要

PURPOSE: Provided is an elastomer adhesive for semiconductor package such as micro ball grid array (BGA), elasticity of which is designed by controlling glass transition temperature. The adhesive composition has a mixed phase of hard segment of high glass transition temperature and soft segment of low glass transition temperature thereby expanding elasticity plateau region in thermal cycling test. CONSTITUTION: The composition comprises 40wt.% of epoxy resin with glass transition temperature of 150 deg.C, 40wt% of nitrile butadiene rubber with glass transition temperature of -30 deg.C, 20wt.% of compatibilizer, rubber modified epoxy and appropriate amount of solvent. With rip coater, adhesive of wanted thickness is produced and its glass transition temperature is in a range of -25 - 125 deg.C.