Photoresist stripping composition

摘要

Disclosed are compositions useful for the removal of polymeric material from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for removing polymer residues from advanced magnetic devices. Also disclosed are methods of removing such polymeric material. The composition includes one or more polar aprotic solvents, one or more polymer dissolution enhancing bases, and one or more corrosion inhibitors, wherein the composition is substantially free of hydroxylamine or hydroxylamine derivatives.