发明名称 COMPOSITION COMPRISING POLYAMIDE RESIN
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition suitable for an industrial material such as an automobile part, an electronic and an electric parts, an industrial mechanical part, etc., having excellent rigidity, strength, impact strength, heat resistance and rigidity and dimensional stability in water absorption, etc. SOLUTION: This resin composition is obtained by compounding (A) a polyamide with (B) a polyamide complex which comprises an apatite type compound containing an organic substance insoluble in a phenol solvent in an amount of 0.5-100 pts.wt. of the organic substance based on 100 pts.wt. of the apatite type compound or a polyamide resin complex obtained by compounding the polyamide complex with another resin and (C) a polycarbonate-based resin.
申请公布号 JP2001234062(A) 申请公布日期 2001.08.28
申请号 JP20000044753 申请日期 2000.02.22
申请人 ASAHI KASEI CORP 发明人 ARAMAKI MASAAKI
分类号 C08G69/04;C08G69/28;C08K3/32;C08K7/16;C08K9/04;C08L69/00;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08G69/04
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