LSI package and inner lead wiring method for same

摘要

A face up BGA package has a plurality of terminals and lead pads on a package substrate. Connecting some of the terminals to their corresponding lead pads via nonconnection terminals when changing the size of a chip mounted on the package substrate makes it possible to connect all necessary terminals and lead pads by using inner leads without short circuiting the inner leads and without shortage of space in which to wire the inner leads.