| 摘要 |
A structure of a capacitor on a semiconductor wafer including the following structure is disclosed herein. A first electrode including a flower structure is formed on the semiconductor wafer. The first electrode includes a flower neck portion, a flower bottom portion, and a flower top portion. The flower neck portion is electrically coupled to the semiconductor wafer. The flower bottom portion is electrically coupled to the flower neck portion, in which the flower bottom portion includes a first protudent portion. The flower top portion includes a downward hemispherical portion and a second protrudent portion, and is electrically coupled to the flower neck portion. The flower bottom portion is formed of titanium nitride, and the flower top portion is formed of Ti/TiN or TiW. A first dielectric film is formed on the first electrode, and the first dielectric layer is the dielectric layer of the capacitor. A second electrode is formed on the first dielectric film.
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