Method for reducing hot sticking in molding processes

摘要

The method of the present invention overcomes the hot-sticking problems between an inorganic non-metallic material (=insulator) to be molded and a forming die by maintaining an assembly comprising a forming die and the insulator in a polarized state during molding. Processes using said method lead to an improved surface quality of the molded insulator. A device for reducing said hot-sticking comprises a die (2) which acts as conductor, an electrode (3) which may act as support for the insulator (1) to be molded, means (5) for polarizing the assembly of said conductor, insulator and electrode which means (5) are connected by live electric wires (4) with said die and electrode.