| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head which can prevent a bonding wire 13 from contacting the other electrode pattern 4 when the electrode pattern 4 is wire bonded to a bonging pad 7. SOLUTION: A plurality of heating resistors 3 are formed on a substrate 1. The electrode pattern 4 including a lead wire 6 to be connected to each heating resistor 3 and bonding pad 7 is formed. The lead wire 6 in the periphery of the bonding pad 7 is placed to a lower position by 0.3-120 μm from the substrate 1 than a surface of the bonding pad 7. The bonding wire 13 connected to the bonding pad 7 can be prevented from contacting the lead wire 6 of the other electrode pattern 4 wired in the periphery of the bonding pad 7. |
