| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which shows excellence in moldability, fire retarding property, high temperature storage property and solder crack resistance. SOLUTION: An epoxy resin composition for sealing a semiconductor contains as essential components (A) a modified epoxy resin obtained by mixing a polyhydroxyl phenol resin (a) with phenols (b) as a precursor of a crystalline epoxy resin followed by glycidyl-etherizing the mixture, (B) a modified phenol resin obtained by polycondensation reaction of a petroleum-based heavy oil or pitches, a polymerized formaldehyde and phenols in the presence of an acid catalyst, (C) an inorganic filler and (D) a curing accelerator, wherein the weight ratio [(a)/(b)] of (a) to (b) is 1 to 19 and the softening point of the epoxy resin (A) is 60 to 120 deg.C.
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