发明名称 |
Piezoelectric sensor for measuring bonding parameters |
摘要 |
A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.
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申请公布号 |
US6279810(B1) |
申请公布日期 |
2001.08.28 |
申请号 |
US20000511707 |
申请日期 |
2000.02.23 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD;THE HONG KONG POLYTECHNIC UNIVERSITY |
发明人 |
CHAN-WONG LAI WA;CHIU SIU SAN;OR SIU WING;CHEUNG YIU MING |
分类号 |
G01L5/00;B23K20/10;H01L21/60;H04R17/00;(IPC1-7):B23K1/06;B23Q15/00 |
主分类号 |
G01L5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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