| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in molding properties, flame retardancy and soldering stress resistance. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises, as essential ingredients, (A) an epoxy resin comprising a glycidyl- etherifie d product (a) of 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and glycidyl- etherified product (b) of bis(3,5-dimethyl-4-hydroxyphenyl)methane, (B) a phenolic resin represented by general formula (1) (wherein n is a positive number of 1-10 on the average), (C) inorganic substances including an inorganic filler and (D) a curing accelerator, where the weight ratio of (a) to (b); (a/b) is 1/3 to 3 and the total of the inorganic substances accounts for 87-94 wt.% of the whole epoxy resin composition.
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