发明名称 Device for controlling treating station
摘要 A control section 20 incorporated in a coating/developing unit 2 is connected to a host computer 4, while a control section 30 incorporated in an exposure unit 3 is connected to the control section 30 of the coating/developing unit 2. Communication with the host computer 4 is performed by the coating/developing unit 2. The control of transfer of a wafer between the coating/developing unit and the exposure unit is executed using a timing signal which is independent of a process instruction output from the host computer 4. The host computer controls the coating/developing unit and the exposure unit using the control section of the coating/developing unit. Supply of instructions to the exposure unit 3 or collection of information therefrom is centrally controlled on the coating/developing unit 2 side.
申请公布号 US6282457(B1) 申请公布日期 2001.08.28
申请号 US19980202040 申请日期 1998.12.07
申请人 TOKYO ELECTRON LIMITED 发明人 MIURA YOSHIKATSU;NAGATA MASAYA;HARADA JUNJI
分类号 H01L21/00;H01L21/66;(IPC1-7):G06F19/00 主分类号 H01L21/00
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