| 摘要 |
An insert-molded leadframe having wire bonding posts formed on an inner portion, device pins formed on an outer portion, and a central portion connecting between the inner portion and the outer portion. Plastic encases the central portion of the conductive leadframe, such that the bonding posts and the device pins are exposed at inner and outer edges, respectively, of the plastic casing. The bonding posts and the device pins are disposed substantially perpendicular to one another. The conductive leadframe is formed with the bonding posts in a first plane and the device pins in a second plane, the first and second planes being substantially mutually parallel. The conductive leadframe then is encased in plastic by injection molding to form the insert-molded leadframe of the invention. An IMS substrate with powertrain electronics is adhered to the bottom of the bonding posts at the inner edge of the insert-molded leadframe, and the powertrain electronics are electrically connected by wire bonding to the top of the bonding posts. A circuit board containing driver electronics is mounted on and electrically connected to the device pins at the outer edge of the plastic casing. |
