| 摘要 |
PROBLEM TO BE SOLVED: To form a coating film of a prescribed thickness even on the outer edge of a substrate by adjusting the temperature of the coating liquid applied to the outer edge. SOLUTION: A heating and cooling member 64 having a ring-like shape corresponding to the shape of a wafer W is installed so as to surround a mounting table 61, on which the wafer W is mounted. This heating and cooling member 64 is heated or cooled to a prescribed temperature by a Peltier element, and is brought into contact with the wafer W from below to heat or cool the rim of the wafer W. As a result, when the rim is heated, the temperature of the resist liquid applied afterward is increased, and the surface tension of the resist liquid is decreased. When it is cooled, the surface tension of the resist liquid is increased. Thereby the thickness of the resist film at the rim of the wafer W can be adjusted to form a prescribed resist film. |
