发明名称 POLISHING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To shorten a polishing time to perform polishing efficiently, provide high precision, and reduce cost in a polishing method for performing precise polishing using abrasive grains. SOLUTION: After polishing a substrate using free abrasive grains 10 mainly, polishing liquid 13 containing diamond abrasive grains having a larger particle diameter than that used in the substrate polishing is supplied to a polishing face 1a of the same surface plate as a polishing surface plate 1 used for substrate polishing, both of them are relatively slid while a correction ring 6 is brought into contact with the polishing face 1a, and a part of the free abrasive grains 10 is embedded into the polishing face 1a to form fixed abrasive grains 11 in order to polish a workpiece by the fixed abrasive grains 11.</p>
申请公布号 JP2001232558(A) 申请公布日期 2001.08.28
申请号 JP20000047283 申请日期 2000.02.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORIWAKI TSUTOMU
分类号 B24B7/00;B24B37/00;B24B55/06;(IPC1-7):B24B37/00 主分类号 B24B7/00
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