发明名称 DEVICE AND METHOD FOR STICKING TAPE TO LEAD OF ELECTRONIC PARTS
摘要 <p>PROBLEM TO BE SOLVED: To prolong a life for a punching mold, form an accurately shaped punched portion of a tape and stick the punched portion to a lead at an accurate position. SOLUTION: This device for sticking a tape to the leads of electronic parts comprises a first punching mole 54 having a recessed portion 54c and a second punching mold 65 adapted be forced into the recessed portion 54c. The rape 4 is punched by the first and second punching molds 54, 65 to form a punched portion 4a in a desired final shape. The punched portion 4a is anchored into the recessed portion 54c and the punched portion 4a anchored into the recessed portion 54c is pushed out and pasted to the lead 3. Thus, the first and second punching molds 54, 65 require small strokes and has less wear than usual, resulting in the long-life tape pasting device.</p>
申请公布号 JP2001232593(A) 申请公布日期 2001.08.28
申请号 JP20000046783 申请日期 2000.02.18
申请人 ALPS ELECTRIC CO LTD 发明人 HARADA ISAO
分类号 B26F1/00;H01L23/50;(IPC1-7):B26F1/00 主分类号 B26F1/00
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