| 摘要 |
PROBLEM TO BE SOLVED: To solve problems that cracks are formed in a ceramic substrate 1 and mechanical strength and airtightness of a joined part are low. SOLUTION: This structure for joining a ceramic substrate 1 to a metal pin 2 is obtained by providing a through-hole 4 having a counter boring part 4a on the side of one of principal planes in an area extending from one of the principal planes of the ceramic substrate 1 having the mutually opposite principal planes to the other principal plane, inserting and passing the nearly circular cylindrical metal pin 2 having a large diameter in the head part 2a through the through-hole 4 so as to house the head part 2a in the counter boring part 4a and filling an adhesive glass 3 in the counter boring part 4a so as to cover the head part 2a of the metal pin 2. The adhesive glass 3 has a surface of a concave surface having a position separated from the principal plane on the side of the counter boring part 4a of the ceramic substrate 1 by >=0.1 mm as an outer periphery. Thermal stress is well dispersed without direct actions of the thermal stress on the vicinity of an opening edge of the counter boring part 4a.
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