| 摘要 |
A pattern and method of a metal line package level test for a semiconductor device, which is capable of efficiently testing characteristic of a metal line. The metal line package level test pattern includes a metal line for test, a current applying pad which is connected to both ends of the metal line, for applying a current to the metal line, a voltage sensing pattern formed at both ends of the metal line, for sensing a voltage of the metal line, and a heater for varying the temperature of the current applying pad.
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