发明名称 HEAT SENSITIVE STENCIL BASE PAPER AND PLATEMAKING METHOD FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To provide heat sensitive stencil paper having durability without wrinkle to be generated at platemaking, without plate attaching fault to a plate cylinder without decreasing in image quality at printing, and a method for manufacturing the same. SOLUTION: The heat sensitive stencil paper is made by laminating melt punchable thermoplastic resin film and a solvent soluble resin film. In this case, both the films may be laminated via a porous layer having a porosity of 30% or more. A thickness of the solvent soluble resin is preferred to be thicker than that of the thermoplastic resin film. After the thermoplastic resin film is formed with a melt punched part, the solvent is given to the thermoplastic resin film side, punched holes are formed at the soluble resin film via the melt punched part and platemade. The punched part is formed by using a thermal head or a laser irradiating means, transferring a photothermal conversion material from a liquid discharging unit to the thermoplastic resin film and irradiating the material with a light.
申请公布号 JP2001232964(A) 申请公布日期 2001.08.28
申请号 JP20000041687 申请日期 2000.02.18
申请人 RISO KAGAKU CORP 发明人 WATANABE HIDEO
分类号 B41C1/055;B41N1/24;(IPC1-7):B41N1/24 主分类号 B41C1/055
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