| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in normal-temperature storage stability, quick curability, and fluidity. SOLUTION: This composition essentially comprises (A) an epoxy resin, (B) a phenol resin, (C) a molecular associate formed from a tetrasubstituted phosphonium (X), a compound (Y) having at least two phenolic hydroxyl groups, and a conjugated base of the compound (Y) having at least two phenolic hydroxyl groups provided the conjugated base is a phenoxide compound formed by removing one hydrogen atom from the compound (Y) having at least two phenolic hydroxyl groups, (D) tetraphenylphosphonium tetra(1-naphthoyloxy) borate, and (E) an inorganic filler. The equivalent ratio of epoxy groups of the epoxy resin to phenolic hydroxyl groups of the phenol resin is 0.5-2. The inorganic filler (E) is compounded in an amount of 200-2,400 pts.wt. based on 100 pts.wt. sum of the epoxy and phenol resins.
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