| 摘要 |
An apparatus and method to polish a wafer using abrasive flow machining (AFM) is provided. Under a high-pressure condition, the wafer is polished by flowing abrasive media with high viscosity, on the wafer in order to planarize the wafer. Therefore, the polishing efficiency is higher, and the attained roughness is lower than the conventional method. In addition, the selectivity of this method is lower. |
