发明名称 CONDUCTIVE ADHESIVE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a conductive adhesive which gives a cured item excellent in electrical conductivity, adhesiveness, resistances to heat and moisture, workability, thermal conductivity, reflecting properties, or the like. SOLUTION: This adhesive contains a conductive powder, an organic resin, and a diluent. The conductive powder has a cumulative 10% particle size of 2.0μm or higher and mainly comprises at least one flaky powder selected from among flaky powders of silver, platinum, and aluminum. The compounding ratio of the flaky powder is 50-90 wt.% and that of the organic resin is 3-40 wt.%.</p>
申请公布号 JP2001234152(A) 申请公布日期 2001.08.28
申请号 JP20000047211 申请日期 2000.02.24
申请人 SUMITOMO METAL MINING CO LTD 发明人 TANAKA MASAFUMI
分类号 C09J201/00;C09J9/02;H01L21/52;(IPC1-7):C09J201/00 主分类号 C09J201/00
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