| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for conditioning a polishing pad. SOLUTION: This chemical mechanical polishing system is a semiconductor wafer treatment system, in particular, to say in more detail, a polishing medium reconditioning system. In one embodiment, the polishing medium reconditioning system is provided with at least a first conditioning roller and a second conditioning roller in contact with a work surface of a polishing medium while it rotates in the opposing direction. In the other embodiment, it includes a conditioning plate arranged on a carrier including a polishing head, a conditioning roller or a disc crossing a surface of the polishing medium, and a conditioning disc conditioning the polishing medium while it is held in the polishing head. Instead the polishing medium can be conditioned using a device performing conditioning apart from the treatment system. |
