| 摘要 |
A vacuum-assisted chuck assembly for coupling to a warped semiconductor wafer is provided. In one embodiment, the assembly comprises a wafer chuck and a conforming perimeter seal. The seal permits effective vacuum coupling of the chuck to the warped wafer without operator intervention. As vacuum pressure is applied, the seal prevents leakage around the warped wafer, allowing the vacuum pressure to deflect the wafer until the wafer contacts and seals against an engaging surface located on the chuck. By utilizing the seal, the chuck assembly may operate at a reduced vacuum pressure as compared to conventional wafer chucks. Furthermore, by providing an effective vacuum seal to the warped wafer surface, manual operator intervention during vacuum coupling is reduced or eliminated.
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