Encapsulated surface mounting electronic part

摘要

An electronic element is mounted on a resin wiring substrate and a cover member is bonded to the wiring substrate so as to cover the electronic element and constitute an encapsulation region. The encapsulation region houses the electronic element and has a cavity inside. A side electrode is formed of an electronically conductive through groove provided in a cover-member-bonding surface on the wiring substrate. A plating layer inside the electrically conductive through groove includes at least two metal layers including an Au plating layer and a Cu plating layer. The plating layer has conductors connected to circumferential peripheries of the electrically conductive through groove on upper and lower surfaces of the wiring substrate. Only the Cu plating layer is formed on the conductor on the upper surface of the wiring substrate to improve the reliability of bonding. The reliability of bonding of the resin wiring substrate and cover member which constitute the encapsulation region is improved, and therefore the reliability of the air-tight seal of the cavity inside the encapsulation region is improved.