| 摘要 |
PROBLEM TO BE SOLVED: To provide the subject resin composition excellent in moisture resistance reliability, soldering crack resistance and high-temperature storability. SOLUTION: This epoxy resin composition for semiconductor sealing use essentially comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing promoter, (D) an inorganic filler, and (E) a compound of the general formula (2) having an average particle size of 0.5-15μm, such a particle size distribution as to be <=10 wt.% and <=3 wt.% in the content of the particles each <=0.2μm in size and in the content of the particles each >=20μm in size, respectively, and specific surface area of <=50 m2/g, obtained by baking a hydrotalcite compound of the general formula (1) at 300-900 deg.C; the general formula (1): MgaAlb(OH)c(CO3)d, and the general formula (2): MgxAlyOz (wherein, (a), b, c, d, x, y and z are each a positive number of 0 or >=1).
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