| 摘要 |
PROBLEM TO BE SOLVED: To maintain a semiconductor chip at a low temperature, in a semiconductor device in which coefficients of linear expansion of an insulating layer and a module board are set to values proximate to that of silicon constituting the semiconductor chip. SOLUTION: A refrigerant chamber 11 is provided directly in contact with a surface of a module board 6 opposite to a surface where a semiconductor chip (IGBT element 2) is arranged. A nozzle 18 for feeding a refrigerant into the refrigerant chamber 11 is provided. The nozzle 18 is arranged at a position such that a refrigerant flow ejected from the nozzle 18 reaches a portion on the back side of the module board 6 at the portion where the semiconductor chip (IGBT element 2) is arranged. |
