发明名称 Radiation-emitting semiconductor element, method for production thereof and radiation emitting optical component
摘要 A radiation-emitting semiconductor component has a multiple layer structure (4) containing a radiation-emitting active layer (5), and a radiation-permeable window (1) having main surfaces (2, 3) and a recess (8) for forming radiation coupling surfaces running diagonally to the first main surface (2). At least one side surface of the window and/or recess limiting the second main surface (3) is provided with a first contact surface (11). An independent claim is also included for the production of a radiation-emitting semiconductor component comprising preparing a window layer with main surfaces; applying a semiconductor layer structure on the first main surface; structuring the window layer to form a recess in the second main surface; forming a contact surface on the side of the second main surface of the window layer; and finishing the semiconductor component. Preferred Features: The window is made from sapphire, quartz glass, diamond, ITO, tin oxide, zinc oxide, indium oxide, silicon carbide or gallium phosphide. The multiple layer structure is based on gallium nitrides.
申请公布号 AU2504501(A) 申请公布日期 2001.08.27
申请号 AU20010025045 申请日期 2000.11.30
申请人 OSRAM OPTO SEMICONDUCTORS GMBH AND CO. OHG 发明人 DOMINIK EISERT;VOLKER HARLE;FRANK KUHN;MANFRED MUNDBROD;UWE STRAUSS;ULRICH ZEHNDER
分类号 H01L33/00;H01L33/20;H01L33/22;H01L33/38;H01L33/40 主分类号 H01L33/00
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