| 摘要 |
PROBLEM TO BE SOLVED: To surely enable highly reliable connection by preliminarily forming protection resin in a conductor pattern which exposes from a cut-out portion provided for a substrate before bending a flexible insulation substrate and thereafter bending and connecting it. SOLUTION: An opening 1a connected to a driving integrated circuit element (IC chip) is formed in a central part of a flexible insulation substrate 1 of a polyimide film and cut-out portions 1b, 1c for bending a wiring substrate are formed right. A conductor pattern lead 2 of which one end projects in the opening 1a crosses the cut-out portions 1b, 1c. A tip of the lead 2 is connected to the bump 4 provided to an IC chip 3 and is sealed by epoxy resin 5 for protection. Protection resin 7 is applied to both surfaces of the lead 2 which exposes from a part provided with the cut-out portions 1b, 1c of a part to be bent and hardened. The lead 2 is connected to an electrode terminal a liquid crystal cell 9 by using an anisotropic conductive film 8. An IC chip side is lifted and a flexible wiring substrate is bent to a reverse U-shape in a part wherein the cut-out portions 1b, 1c are formed. |
