| 摘要 |
An insulating refractory composition which is fiber free and comprises a lightweight refractory filler of tamped bulk density no greater than 0.4 g/cc, hollow refractory microspheres and a binder, the binder being water-based or curable at about 100° C. or below, the composition being curable by microwaves and having a cured density of less than 0.45 g/cc. |
