| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for forming a solder bump, capable of ensuring sufficient volume of solder for a minute electrode. SOLUTION: Solder paste 311 is printed on a group of first electrodes 111 on a wiring board 100 (Fig. 2-A to 2-D), and after this, the solder paste is thermally fused to form a group of first solder bumps 312 (Fig. 2-E). In addition to this step, the solder paste 311 is printed on the group of first solder bumps 312, using a second printing mask 221 having a larger opening 223 than that of a printing mask 211, then the solder paste is thermally fused, to form a group of second solder bumps 322.</p> |
