发明名称 METHOD OF MANUFACTURING METALLIC PLATE FOR HEAT DISSIPATION
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a metallic plate for heat dissipation which can reduce warpage when joined to a package main body. SOLUTION: A plate member made of copper-molybdenum-based composite metallic material is rolled in a first direction perpendicular to its thickness direction (S2), and is rolled in the thickness direction and in a second direction perpendicular to the first direction (S3). A ratio in thickness between the plate member rolled in the second direction and the plate member before rolled is not smaller than 20% and not larger than 40%. Thus the interior anisotropy of the plate member after rolled is removed so that the member has a suitable thermal expansion coefficient and the warpage of a resulting metallic plate for heat dissipation is reduced. Further, since the plate member processed (S4) into a predetermined shape by punching ins subjected to heat treatment (S5), the interior distortion of the plate member after processed can be removed. Accordingly the warpage of the metallic member when joined to a package main body can be reduced and an electronic component can be firmly fixed on the metallic member.
申请公布号 JP2001230350(A) 申请公布日期 2001.08.24
申请号 JP20000034792 申请日期 2000.02.14
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 KOSAKATA AKIYOSHI
分类号 H01L23/36;H01L23/06;H01L23/373;(IPC1-7):H01L23/36 主分类号 H01L23/36
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