| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board sensitive resin adhesives film which is superior in heat resistance, formability and surface smoothness. SOLUTION: In a multilayer printed wiring board sensitive resin adhesives film through the use of a thermoelastic resin film of thickness 35 to 100μm as a carrier film, a sensitive resin composition is applied thereto, and a solvent is volatilized to be made into film. Preferably, the sensitive resin composition is formed with the following composition: (a) a epoxy resin of epoxy equivalent weight of 500 or lower, (b) an epoxy resin curing agent, (c) a monomer having a plurality of optical functional group and/or a multifunctional monomer having an optical functional base and a thermal functional base, (d) on optical polymerization initiator, and (e) an inorganic filler. |
