| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire, having a solder ball and a method for changing connection of a wiring board, capable of facilitate to change connection of a wiring board including an electronic component of BGA or CSP type. SOLUTION: A wire with a solder ball is provided with a solder ball 1 and a wire 2, whose diameter is smaller than that of the solder ball 1 and is constituted by connection the solder ball 1 to at least one end of the wire 2.
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