| 摘要 |
PROBLEM TO BE SOLVED: To realize a surface emitting body which uses a thin printed-circuit board and which is thin. SOLUTION: In the manufacturing method for the surface emitting body, a plurality of light emitting elements 8 are sealed on a resin substrate 1. A sealing resin 9 is permeated into pinholes 9 which remain on the resin substrate 1 by etching a metal foil 2 so as to be resin-sealed. Regions 6 in which the pinholes exist are punched or cut. As a result, the surface emitting body in a prescribed shape is obtained. |
