| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-size, low-cost and good-characteristics high frequency integrated circuit, without needing any special structure or complicated manufarting process. SOLUTION: A BCB thin film 103 is laminated on a silicon substrate 101, through-holes 110 are provided through the film 103 to form hollows 109 for blocking a sealant 108 from flowing between an MMIC 106 and the silicon substrate 101 during mounting of the MMIC 106, MMIC mounting pads are formed, using a topmost layer wiring, the MMIC with bumps formed on signal lectrodes, GND electrodes, bias electrodes, etc., is flip-chip-mounted, and after the flip chip mounting, the sealant is injected between the MMIC and BCB film and cured to tightly fix the MMIC and block the sealant from penetrating into through-hole portions. |
