METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve a problem that a throughput in the probe inspection and appearance inspection steps cannot be improved because a marking is made on a defective chip in the probe inspection step or appearance inspection step so that a die bonding device is allowed to recognize defective chips in the periphery of a wafer. SOLUTION: A defective chip 2 in the non-formation part 5 in which no chip pattern is formed in the periphery of a wafer is provided with a specified pattern to make a contrast in some color. The pattern is formed by using an unmagnified projection aligner at the same time when forming an aluminum wiring or a protection film (passivation film). Thus, no making is needed for the defective chip 2 in the probe inspection step or appearance inspection step, and the defective chip 2 can be recognized by a die bonding device.