| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method by which the flatness of a semiconductor substrate is hard to be deteriorated and no particle is produced when a hard mark is formed on the semiconductor substrate. SOLUTION: In a semiconductor device wherein an alphanumeric identification symbol is indicated on the surface of a semiconductor substrate 3 by using a dot 1, the dot 1 is formed by laser beam processing. To remove a projecting part caused by the melted substrate material during the formation of the dot 1, a counter-sunk part 5 (chamfered part) is formed around the periphery of the opening of the dot 1.
|
