| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which can further increase the density of a printed circuit board and manufacture a printed circuit substrate material simply and economically which is superior in dimensional precision, and a manufacturing apparatus of a wire structure which can be suitably used therefor. SOLUTION: In a method for manufacturing a printed circuit substrate material, after a plurality of metallic fine pins 12 are mounted on a molding type 10, having a plurality of fine holes 11 at a prescribed pitch, the molding type 10 is vibrated, whereby the plurality of metallic fine pins 12 are inserted into the plurality of fine holes 11 of the molding type 10 and erected, and the plurality of metallic fine pins 12 are provided in parallel in the molding type 10 at a prescribed pitch. After that, a composite material composed of plastics and ceramics is made to flow into this molding type 10, and is cured.
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