| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a stable adhesion by reducing the adhesion difference between an insulative base and a chip. SOLUTION: The semiconductor device comprises a semiconductor chip 6 with pads 7, a polyimide tape 1 adhered onto the semiconductor ship 7, Cu patterns 2 formed on the polyimide tape 1, each comprising bonding parts 2WB connected to the chip 7, pads 2BP connected to solder bumps 11, and wiring pars 2WR for connecting the bonding parts 2WB and the pads 2BP, and electrically floating islands 2IL formed on the polyimide tape 1. |
