| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance positional accuracy by eliminating the effect of disturbance on an inching stage subjected to positional control. SOLUTION: The supporting apparatus comprises an XYθdrive unit 3 and a Z linear motor 4 constituting a position control means of XYZ axial positions and tilt angleθof a wafer stage top plate 12 in an inching stage 1 mounting a work, i.e., a wafer W, and in-plane free self weight supports 5 disposed at a plurality of geometrically symmetric positions to constitute means for supporting the self weight of the wafer stage top plate 12 wherein the self weight supporting means comprises an attraction magnet 23 and a lifting iron plate 27 and the dimensions in a plane perpendicular to the acting direction of magnet force are different between the magnet body 24 of the attraction magnet 23 and the lifting iron plate 27.</p> |
