SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the material cost while raising the reliability on the solder junction between the base plate and the ceramic insulating substrate of a semiconductor device. SOLUTION: A Cu/Mo base plate 1 which is a little larger than a ceramic insulating substrate 2 but is roughly as large as it is joined by solder with the above substrate 2, and also the periphery of the above base plate 1 is surrounded completely by an Fe frame 4 which has an opening 4H of stepped structure being joined through an adhesive 6 with the flank 1SS around the Cu/Mo base plate 1 and the top peripheral edge 1P. Then, tapped holes for fastening by screw with heat radiating fins are made at the four corners of the Fe frame 4.