发明名称 SOLDERING METHOD AND SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a soldering method and a soldering device which can decrease operation man-hour by performing soldering of a pair of joint faces at the same time with the joint faces maintained at even temperature. SOLUTION: The method is for soldering a thermit case 26 with a pair of bus bars 11a, 19a to be electrically connected with this thermit case 26. A point P to be heated nearly the same distance away from the pair of bus bars 11a, 19a inside the thermit case 26 is heated with a gas burner 71, and after the point P is finished heating, soldering wire is supplied from a soldering wire supply part 75a, 75b to a pair of joint faces 22 at the same time for joining the thermit case 26 and the pair of bus bars 11a, 19a. Heating the heated point P makes temperature even at the pair of joint faces 22, therefore, soldering wire can be supplied to the joint faces 22 at the same time, and moreover, there is no more need for using optical absorbent, hence a decreased operation man-hour.
申请公布号 JP2001230040(A) 申请公布日期 2001.08.24
申请号 JP20000035606 申请日期 2000.02.14
申请人 YAZAKI CORP 发明人 TAKAHASHI HIDEO;YAMAGUCHI NOBORU
分类号 B23K1/00;B23K3/04;B23K31/02;B23K35/14;B23K35/34;B23K101/38;H01M2/26;H01M2/34;H01M6/50;H01R43/02;(IPC1-7):H01R43/02 主分类号 B23K1/00
代理机构 代理人
主权项
地址