发明名称 THERMOSETTING PHOTOSENSITIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting photosensitive material capable of forming a high sensitivity pattern excellent in resolution, having good solvent and heat resistances and suitable for use as an interlayer dielectric film for a thin film magnetic head by a simple method. SOLUTION: The thermosetting photosensitive material contains 5-30 pts.wt. epoxy compound of formula 2 (where X is H or a 1-6C alky; Y is a 1-6C trivalent linear or cyclic aliphatic group or a 6-9C trivalent aromatic group; (a) is a positive number of 1-20; (b) and (c) are each a positive number of 1-3, b+c=4; and (d) is a number of 0-3) based on 100 pts. wt. resin having repeating units of formula 1 (where R is H or the residue of a 1, 2- naphthoquinonediazido-4- or -5-sulfonic ester, the proportion of the residue is 2.5-27 mol% and (m) is an integer of 0-3) and having a weight average molecular weight of 1,000-10,000 and further contains a solvent which dissolves these.
申请公布号 JP2001228605(A) 申请公布日期 2001.08.24
申请号 JP20000037369 申请日期 2000.02.16
申请人 SHIN ETSU CHEM CO LTD 发明人 UEDA TAKASHI;ARAKI KENJI;KATO HIDETO
分类号 H01L21/027;C08G59/62;G03F7/004;G03F7/022;G03F7/023;G03F7/032;G03F7/40 主分类号 H01L21/027
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