PRINTED WIRING BOARD, ITS HEAT TREATING METHOD AND HEATER

摘要

PROBLEM TO BE SOLVED: To enhance jointing strength and long-term reliability of a soldering part by using lead-free solder. SOLUTION: This method for heat treating a printed wiring board comprises the steps of soldering by solder connection a solder land part of a printed wiring board and an electrode part of electronic components, and annealing the soldering part by holding it hot at a temperatures of 100 deg.C or higher which do not fuse a solder, after it is soldered.