| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate to form a take-off electrode onto a both-end face of a capacitor in a circuit substrate, in which a laminated capacitor is buried in a multilayered substrate in which a plurality of ceramic layers are laminated. SOLUTION: A wiring pattern 5 is structured by a through-hole 3 and a conductor member 4 which are formed in respective ceramic layers 1a to 1d inside and on the surface of a multilayered substrate 2, and a capacitor 6 in which a dielectric layer 6a and a conductor electrode layer 6b are laminated is embedded in a hole 7 formed in the ceramic layer 1a of an upmost layer. A laminating direction of this capacitor 6 is at a substantially right angle to a laminating direction of the multilayered substrate 2, so that the end face of the capacitor 6 faces both the front and reverse surfaces of the ceramic layer 1a, and a conductor electrode layer 6b of the capacitor 6 is connected electrically to the wiring pattern 5 on both the front and reverse faces of the ceramic layer 1a.</p> |
