| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a three-dimensional molding circuit board, where a finer circuit pattern can be baked and superior wire- bonding properties and corrosion resistance are given. SOLUTION: In the manufacturing method of a three-dimensional molding circuit board, the surface of the base three-dimensional molding circuit board formed, using a simple plating plastic material is roughened, and electroless copper plating is conducted on a roughened face. Resist is applied to an electroless copper plating layer. Then, a face, to which resist is applied is sequentially exposed, developed and etched. Thus, a base circuit pattern formed of electroless copper plating is formed. Electroless nickel is given to the base circuit pattern formed of electroless copper plating, and electroless gold plating given to the electroless nickel layer. Consequently, the three-dimensional molding circuit of a completed article is obtained. The upper side of the electroless copper plating layer given on the roughened face is polished to mirror-surface finish.
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