发明名称 STRUCTURE OF COMPOUND DIAMETER VIA AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a pin connection structure which has minimum capacitance and imparts rigid mechanical fixture of a connector to a printed circuit board. SOLUTION: This connection structure is a structure, which imparts connection to a circuit board and includes a via having a plurality of diameters, a first section of the via having a first inside diameter, and a second section of the via which is positioned below the first section and has a diameter smaller than the first inside diameter. Practically, all the surface regions of the via is subjected to plating, and a plating surface of the via is formed.</p>
申请公布号 JP2001230509(A) 申请公布日期 2001.08.24
申请号 JP20000391012 申请日期 2000.12.22
申请人 HEWLETT PACKARD CO <HP> 发明人 MORRIS TERREL L
分类号 H01R12/04;H01R4/02;H05K1/11;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H05K1/11 主分类号 H01R12/04
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